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HIGH-SPEED 3.3V 32K x 9 SYNCHRONOUS PIPELINED DUAL-PORT STATIC RAM
.eatures:
x x
PRELIMINARY IDT70V9179L
x
x
x x
True Dual-Ported memory cells which allow simultaneous access of the same memory location High-speed clock to data access - Commercial: 7.5/9/12ns (max.) Industrial: 9ns (max) Low-power operation - IDT70V9179L Active: 500mW (typ.) Standby: 1.5mW (typ.) Flow-Through or Pipelined output mode on either port via the FT/PIPE pins Counter enable and reset features Dual chip enables allow for depth expansion without
x
x x
x
additional logic Full synchronous operation on both ports - 4ns setup to clock and 0ns hold on all control, data, and address inputs - Data input, address, and control registers - Fast 7.5ns clock to data out in the Pipelined output mode - Self-timed write allows fast cycle time - 12ns cycle time, 83MHz operation in Pipelined output mode LVTTL- compatible, single 3.3V (0.3V) power supply Industrial temperature range (-40C to +85C) is available for selected speeds Available in a 100-pin Thin Quad Flatpack (TQFP)
.unctional Block Diagram
R/WL OEL CE0L CE1L R/WR OER CE0R CE1R
1 0 0/1
1 0 0/1
FT/PIPEL
0/1
1
0
0
1
0/1
FT/PIPER
I/O0L - I/O8L I/O Control I/O Control
I/O0R - I/O8R
A14L A0L CLKL ADSL CNTENL CNTRSTL Counter/ Address Reg. MEMORY ARRAY Counter/ Address Reg.
A14R A0R CLKR ADSR CNTENR CNTRSTR
5645 drw 01
JANUARY 2002
1
(c)2002 Integrated Device Technology, Inc. DSC-5645/1
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Description:
The IDT70V9179 is a high-speed 32K x 9 bit synchronous DualPort RAM. The memory array utilizes Dual-Port memory cells to allow simultaneous access of any address from both ports. Registers on control, data, and address inputs provide minimal setup and hold times. The timing latitude provided by this approach allows systems to be designed with very short cycle times. With an input data register, the IDT70V9179 has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. Fabricated using IDT's CMOS high-performance technology, these devices typically operate on only 500mW of power.
Pin Configuration(1,2,3)
Index
NC NC A7L A8L A9L A10L A11L A12L A13L A14L NC NC VDD NC NC NC NC CE0L CE1L CNTRSTL R/WL OEL FT/PIPEL NC NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 3 73 4 72 1 2 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 71 70 69 68 67 66 65
NC NC A6L A5L A4L A3L A2L A1L A0L CNTENL CLKL ADSL Vss Vss
ADSR CLKR CNTENR A0R A1R A2R A3R A4R A5R A6R NC
64 63 62 61 60 59 58 57 56 55 54 53 52
70V9179PF PN100-1(4) 100-Pin TQFP Top View(5)
51 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
NC NC A7R A8R A9R A10R A11R A12R A13R A14R NC NC Vss NC NC NC NC CE0R CE1R CNTRSTR R/WR OER FT/PIPER Vss NC
5645 drw 02
NOTES: 1. All VDD pins must be connected to power supply. 2. All VSS pins must be connected to ground. 3. Package body is approximately 14mm x 14mm x 1.4mm. 4. This package code is used to reference the package diagram. 5. This text does not indicate orientation of the actual part-marking.
Vss I/O8L I/O7L I/O6L I/O5L I/O4L I/O3L I/O2L Vss I/O1L I/O0L VDD Vss I/O0R I/O1R I/O2R VDD I/O3R I/O4R I/O5R I/O6R I/O7R I/O8R NC NC
6.42 2
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Pin Names
Left Port CE0L, CE1L R/WL OEL A0L - A14L I/O0L - I/O8L CLKL ADSL CNTENL CNTRSTL FT/PIPEL Right Port CE0R, CE1R R/WR OER A0R - A14R I/O0R - I/O8R CLKR ADSR CNTENR CNTRSTR FT/PIPER VDD VSS Names Chip Enables Read/Write Enable Output Enable Address Data Input/Output Clock Address Strobe Enable Counter Enable Counter Reset Flow-Through / Pipeline Power (3.3V) Ground (0V)
5645 tbl 01
Truth Table IRead/Write and Enable Control(1,2,3)
OE X X X L H CLK X CE0 H X L L L CE1 X L H H H R/W X X L H X I/O0-8 High-Z High-Z DATAIN DATAOUT High-Z Deselected-Power Down Deselected-Power Down Write Read Outputs Disabled
5645 tbl 02
MODE
NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. ADS, CNTEN, CNTRST = X. 3. OE is an asynchronous input signal.
Truth Table IIAddress Counter Control(1,2,6)
Address An X X X Previous Address X An An + 1 X Addr Used An An + 1 An + 1 Ao CLK(6) ADS L
(4)
CNTEN X L
(5)
CNTRST H H H L
(4)
I/O(3) DI/O (n) DI/O(n+1) DI/O(n+1) DI/O(0) External Address Used
MODE
H H X
Counter Enabled--Internal Address generation External Addre ss Blocked--Counter disabled (An + 1 reused) Counter Reset to Address 0
5645 tbl 03
H X
NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. CE0 and OE = VIL; CE1 and R/W = VIH. 3. Outputs configured in Flow-Through Output mode; if outputs are in Pipelined mode the data out will be delayed by one cycle. 4. ADS and CNTRST are independent of all other signals including CE0 and CE1. 5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other signals including CE0 and CE1. 6. While an external address is being loaded (ADS = VIL), R/W = VIH is recommended to ensure data is not written arbitrarily.
6.42 3
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Recommended Operating Temperature and Supply Voltage
Grade Commercial Industrial Ambient Temperature(1) 0OC to +70OC -40OC to +85OC GND 0V 0V VDD 3.3V + 0.3V 3.3V + 0.3V
5645 tbl 04
Recommended DC Operating Conditions
Symbol VDD VSS VIH VIL Parameter Supply Voltage Ground Input High Voltage Input Low Voltage Min. 3.0 0 2.0V -0.3
(1)
Typ. 3.3 0
____
Max. 3.6 0 VDD+0.3V 0.8
(2)
Unit V V V V
5645 tbl 05
NOTES: 1. This is the parameter TA. This is the "instant on" case temperature.
____
NOTES: 1. VIL > -1.5V for pulse width less than 10 ns. 2. VTERM must not exceed VDD +0.3V.
Absolute Maximum Ratings(1)
Symbol VTERM(2) Rating Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature DC Output Current Commercial & Industrial -0.5 to +4.6 Unit V
Capacitance(1)
Symbol CIN COUT(3)
(TA = +25C, f = 1.0MHZ)
Parameter Input Capacitance Output Capacitance Conditions(2) VIN = 3dV VOUT = 3dV Max. 9 10 Unit pF pF
5645 tbl 07
TBIAS TSTG IOUT
-55 to +125 -65 to +150 50
o
C C
o
mA
5645 tbl 06
NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed VDD +0.3V for more than 25% of the cycle time or 10ns maximum, and is limited to < 20mA for the period of VTERM > VDD + 0.3V.
NOTES: 1. These parameters are determined by device characterization, but are not production tested. 2. 3dV references the interpolated capacitance when the input and output switch from 0V to 3V or from 3V to 0V. 3. COUT also references CI/O.
DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V 0.3V)
70V9179L Symbol |ILI| |ILO| VOL VOH Parameter Input Leakage Current
(1)
Test Conditions VDD = 3.6V, VIN = 0V to VDD CE = VIH or CE1 = VIL, VOUT = 0V to VDD IOL = +4mA IOH = -4mA
Min.
___
Max. 5 5 0.4
___
Unit A A V V
5645 tbl 08
Output Leakage Current Output Low Voltage Output High Voltage
___
___
2.4
NOTE: 1. At VDD < 2.0V input leakages are undefined.
6.42 4
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating Temperature Supply Voltage Range(3) (VDD = 3.3V 0.3V)
70V9179L7 Com'l Only Symbol IDD Parameter Dynamic Operating Current (Both Ports Active) Standby Current (Both Ports - TTL Level Inputs) Standby Current (One Port - TTL Level Inputs) Full Standby Current (Both Ports - CMOS Level Inputs) Full Standby Current (One Port - CMOS Level Inputs) Test Condition CEL and CER= VIL, Outputs Disabled, f = fMAX(1) CEL = CER = VIH f = fMAX(1) CE"A" = VIL and CE"B" = VIH(5) Active Port Outputs Disabled, f=fMAX(1) Both Ports CEL and CER > VDD - 0.2V, VIN > VDD - 0.2V or VIN < 0.2V, f = 0(2) Version COM'L IND COM'L IND COM'L IND COM'L IND L L L L L L L L L L Typ. (4) 200
____
70V9179L9 Com'l & Ind Typ. (4) 180 180 50 50 110 110 0.4 0.4 100 100 Max. 260 280 100 120 190 205 3.0 6.0 180 195
70V9179L12 Com'l Only Typ. (4) 150
____
Max. 310
____
Max. 230
____
Unit mA
ISB1
65
____
130
____
40
____
80
____
mA
ISB2
140
____
245
____
100
____
175
____
mA
ISB3
0.4
____
3
____
0.4
____
3
____
mA
ISB4
COM'L CE"A" < 0.2V and CE"B" > VDD - 0.2V(5) IND VIN > VDD - 0.2V or VIN < 0.2V, Active Port, Outputs Disabled, f = fMAX(1)
130
____
235
____
90
____
165
____
mA
NOTES: 1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input levels of GND to 3V. 2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby. 3. Port "A" may be either left or right port. Port "B" is the opposite from port "A". 4. VDD = 3.3V, TA = 25C for Typ, and are not production tested. IDD DC(f=0) = 90mA (Typ). 5. CEX = VIL means CE0X = VIL and CE1X = VIH CEX = VIH means CE0X = VIH or CE1X = VIL CEX < 0.2V means CE0X < 0.2V and CE1X > VDD - 0.2V CEX > VDD - 0.2V means CE0X > VDD - 0.2V or CE1X < 0.2V "X" represents "L" for left port or "R" for right port.
5645 tbl 09
6.42 5
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
AC Test Conditions
Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3.0V 3ns Max. 1.5V 1.5V Figures 1, 2, and 3
5645 tbl 10
3.3V
3.3V
590 DATAOUT 435 30pF DATAOUT 435
590
5pF*
5645 drw 03
5645 drw 04
Figure 1. AC Output Test load.
Figure 2. Output Test Load (For tCKLZ, tCKHZ, tOLZ, and tOHZ). *Including scope and jig.
8 7 6 5 tCD1, tCD2 (Typical, ns) 4 3 2 1 0 -1
- 10pF is the I/O capacitance of this device, and 30pF is the AC Test Load Capacitance
20 40 60 80 100 120 140 160 180 200 Capacitance (pF)
5645 drw 05
.
Figure 3. Typical Output Derating (Lumped Capacitive Load).
6.42 6
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the Operating Temperature Range (Read and Write Cycle Timing)(3) (VDD = 3.3V 0.3V, TA = 0C to +70C)
70V9179L7 Com'l Only Symbol tCYC1 tCYC2 tCH1 tCL1 tCH2 tCL2 tR tF tSA tHA tSC tHC tSW tHW tSD tHD tSAD tHAD tSCN tHCN tSRST tHRST tOE tOLZ tOHZ tCD1 tCD2 tDC tCKHZ tCKLZ Clock Cycle Time (Flow-Through) Clock Cycle Time (Pipelined)
(2)
70V9179L9 Com'l & Ind Min. 25 15 12 12 6 6
____ ____
70V9179L12 Com'l Only Min. 30 20 12 12 8 8
____ ____
Parameter
(2)
Min. 22 12 7.5 7.5 5 5
____ ____
Max.
____ ____ ____ ____ ____ ____
Max.
____ ____ ____ ____ ____ ____
Max.
____ ____ ____ ____ ____ ____
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Clock High Time (Flow-Through)(2) Clock Low Time (Flow-Through) Clock High Time (Pipelined) Clock Low Time (Pipelined) Clock Rise Time Clock Fall Time Address Setup Time Address Hold Time Chip Enable Setup Time Chip Enable Hold Time R/W Setup Time R/W Hold Time Input Data Setup Time Input Data Hold Time ADS Setup Time ADS Hold Time CNTEN Setup Time CNTEN Hold Time CNTRST Setup Time CNTRST Hold Time Output Enable to Data Valid Output Enable to Output Low-Z(1) Output Enable to Output High-Z
(1) (2) (2) (2)
(2)
3 3
____ ____ ____ ____ ____ ____ ____ ____ ____
3 3
____ ____ ____ ____ ____ ____ ____ ____ ____
3 3
____ ____ ____ ____ ____ ____ ____ ____ ____
4 0 4 0 4 0 4 0 4 0 4 0 4 0
____
4 1 4 1 4 1 4 1 4 1 4 1 4 1
____
4 1 4 1 4 1 4 1 4 1 4 1 4 1
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
9
____
12
____
12
____
2 1
____ ____
2 1
____ ____
2 1
____ ____
7 18 7.5
____
7 20 9
____
7 25 12
____
Clock to Data Valid (Flow-Through) Clock to Data Valid (Pipelined)
(2)
Data Output Hold After Clock High Clock High to Output High-Z Clock High to Output Low-Z
(1)
2 2 2
2 2 2
2 2 2
9
____
9
____
9
____
(1)
Port-to-Port Delay tCWDD tCCS Write Port Clock High to Read Data Delay Clock-to-Clock Setup Time
____ ____
28 10
____ ____
35 15
____ ____
40 15
ns ns
5645 tbl 11
NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed by device characteriza tion, but is not production tested. 2. The Pipelined output parameters (tCYC2, tCD2) apply to either or both the Left and Right ports when FT/PIPE = VIH. Flow-through parameters (tCYC1, tCD1) apply when FT/PIPE = VIL for that port. 3. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE), FT/PIPER, and FT/PIPEL.
6.42 7
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of Read Cycle for .low-Through Output (FT/PIPE"X" = VIL)(3,6)
tCYC1 tCH1 CLK
CE0
tCL1
tSC CE1
tHC
tSC
tHC
R/W
tSW tHW tSA tHA An + 1 tCD1 tDC Qn tCKLZ
(1)
ADDRESS
(5)
An
An + 2
An + 3 tCKHZ (1)
DATAOUT
Qn + 1
(1)
Qn + 2 tOLZ (1) tDC
tOHZ
OE
(2)
tOE
5645 drw 06
Timing Waveform of Read Cycle for Pipelined Operation (FT/PIPE"X" = VIH)(3,6)
tCYC2 tCH2 CLK
CE0
tCL2
tSC CE1
tHC
tSC
(4)
tHC
R/W
tSW tSA
tHW tHA An + 1 (1 Latency) tCD2 Qn tCKLZ
(1)
ADDRESS(5)
An
An + 2 tDC Qn + 1
An + 3
DATAOUT
Qn + 2(6) tOLZ(1)
tOHZ(1)
OE
(2)
tOE
5645 drw 07 NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge. 3. ADS = VIL, CNTEN and CNTRST = VIH. 4. The output is disabled (High-Impedance state) by CE0 = VIH or CE1 = VIL following the next rising edge of the clock. Refer to Truth Table 1. 5. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 6. "X' here denotes Left or Right port. The diagram is with respect to that port.
6.42 8
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of a Bank Select Pipelined Read(1,2)
tCH2 CLK tSA ADDRESS(B1) tSC
CE0(B1)
tCYC2 tCL2
tHA A0 tHC tSC tCD2 tHC tCD2 Q0 tDC tCKHZ(3) Q1 tDC A3 A4 tCD2 Q3 tCKLZ
(3)
A1
A2
A3
A4
A5
A6
DATAOUT(B1) tSA ADDRESS(B2) tHA A0 A1
tCKHZ (3) A5 A6
A2
tSC tHC
CE0(B2)
tSC
tHC tCD2 tCKHZ Q2 tCKLZ
(3)
tCD2
(3)
DATAOUT(B2)
tCKLZ(3)
Q4
5645 drw 08
Timing Waveform with Port-to-Port .low-Through Read(4,5,7)
CLK "A" tSW tHW R/W "A" tSA ADDRESS "A" tHA
NO MATCH
MATCH
tSD DATAIN "A"
VALID
tHD
tCCS CLK "B"
(6)
tCD1 R/W "B" tSW tSA ADDRESS "B" tHW tHA
NO MATCH
MATCH
tCWDD DATAOUT "B" tDC
(6)
tCD1
VALID VALID
tDC
5645 drw 09
NOTES: 1. B1 Represents Bank #1; B2 Represents Bank #2. Each Bank consists of one IDT70V9179 for this waveform, and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation. 2. OE, and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and CNTRST = VIH. 3. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 4. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. 5. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to. 6. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD. If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. tCWDD does not apply in this case. 7. All timing is the same for both Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite from Port "A".
6.42 9
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of Pipelined Read-to-Write-to-Read (OE = VIL)(3)
tCYC2 tCH2 tCL2 CLK
CE0
tSC CE1
tHC
tSW tHW R/W tSW tHW
ADDRESS
(4)
An tSA tHA
An +1
An + 2
An + 2 tSD tHD Dn + 2
An + 3
An + 4
DATAIN
(2)
tCD2 Qn READ
tCKHZ
(1)
tCKLZ
(1)
tCD2 Qn + 3
DATAOUT
NOP
(5)
WRITE
READ
5645 drw 10
Timing Waveform of Pipelined Read-to-Write-to-Read (OE Controlled)(3)
tCH2 CLK
CE0
tCYC2 tCL2
tSC CE1
tHC
tSW tHW R/W tSW tHW
ADDRESS DATAIN
(4)
An tSA tHA
An +1
An + 2 tSD tHD
An + 3
An + 4
An + 5
(2)
tCD2 Qn tOHZ(1)
Dn + 2
Dn + 3
tCKLZ(1)
tCD2 Qn + 4
DATAOUT
OE
READ
WRITE
READ
5645 drw 11
NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 3. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation". 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
6.42 10
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of .low-Through Read-to-Write-to-Read (OE = VIL)(3)
tCH1 CLK tCYC1 tCL1
CE0
tSC CE1
tHC
tSW tHW R/W tSW tHW
ADDRESS
(4)
tSA DATAIN
(2)
An tHA
An +1
An + 2
An + 2 tSD tHD Dn + 2
An + 3
An + 4
tCD1 Qn tDC READ
tCD1 Qn + 1 tCKHZ NOP (5)
(1)
tCD1
tCD1 Qn + 3 tDC
5645 drw 12
DATAOUT
tCKLZ WRITE
(1)
READ
Timing Waveform of .low-Through Read-to-Write-to-Read (OE Controlled)(3)
tCYC1 tCH1 tCL1 CLK
CE0
tSC CE1
tHC
tSW tHW R/W ADDRESS
(4)
tSW tHW An tSA tHA An +1 An + 2 tSD tHD Dn + 2
(2)
An + 3
An + 4
An + 5
DATAIN tCD1 Qn tOHZ (1)
OE
Dn + 3
tDC
tOE tCD1
(1)
tCD1 Qn + 4 tDC
DATAOUT
tCKLZ
READ
WRITE
READ
5645 drw 13
NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 3. CE0 and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation". 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
6.42 11
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of Pipelined Read with Address Counter Advance (1)
tCH2 CLK tSA ADDRESS An tSAD tHAD
ADS
tCYC2 tCL2
tHA
tSAD tHAD
CNTEN
tSCN tHCN tCD2
DATAOUT
Qx - 1(2)
Qx tDC
Qn
Qn + 1
Qn + 2(2)
Qn + 3
READ EXTERNAL ADDRESS
READ WITH COUNTER
COUNTER HOLD
READ WITH COUNTER
5645 drw 14
Timing Waveform of .low-Through Read with Address Counter Advance(1)
tCH1 CLK tSA ADDRESS tHA tCYC1 tCL1
An tSAD tHAD
ADS
tSAD tHAD tSCN tHCN
CNTEN
tCD1 DATAOUT Qx(2) tDC READ EXTERNAL ADDRESS READ WITH COUNTER COUNTER HOLD READ WITH COUNTER
5645 drw 15
Qn
Qn + 1
Qn + 2
Qn + 3(2)
Qn + 4
NOTES: 1. CE0 and OE = VIL; CE1, R/W, and CNTRST = VIH. 2. If there is no address change via ADS = VIL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output remains constant for subsequent clocks.
6.42 12
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Timing Waveform of Write with Address Counter Advance (.low-Through or Pipelined Outputs)(1)
tCH2 CLK tSA ADDRESS tHA tCYC2 tCL2
An
INTERNAL(3) ADDRESS tSAD tHAD
ADS
An(7)
An + 1
An + 2
An + 3
An + 4
CNTEN(7)
tSD tHD DATAIN Dn WRITE EXTERNAL ADDRESS Dn + 1 Dn + 1 Dn + 2 Dn + 3 Dn + 4
WRITE WRITE WITH COUNTER COUNTER HOLD
WRITE WITH COUNTER
5645 drw 16
Timing Waveform of Counter Reset (Pipelined Outputs)(2)
tCH2 CLK tSA tHA ADDRESS(4) INTERNAL(3) ADDRESS R/W
ADS CNTEN
tCYC2 tCL2
An
(6)
An + 1
An + 2
Ax
0 tSW tHW
1
An
An + 1
tSAD tHAD tSCN tHCN tSRST tHRST
CNTRST
tSD
tHD D0 Q0 Q1 READ ADDRESS n READ ADDRESS n+1 Qn
DATAIN DATAOUT(5) COUNTER RESET
(6)
WRITE ADDRESS 0
READ ADDRESS 0
READ ADDRESS 1
NOTES: 5645 drw 17 1. CE0 and R/W = VIL; CE1 and CNTRST = VIH. 2. CE0 = VIL; CE1 = VIH. 3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 6. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset cycle. ADDR0 will be accessed. Extra cycles are shown here simply for clarification. 7. CNTEN = VIL advances Internal Address from `An' to `An +1'. The transition shown indicates the time required for the counter to advance. The `An +1' Address is written to during this cycle.
6.42 13
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
.unctional Description
The IDT70V9179 provides a true synchronous Dual-Port Static RAM interface. Registered inputs provide minimal set-up and hold times on address, data, and all critical control inputs. All internal registers are clocked on the rising edge of the clock signal, however, the self-timed internal write pulse is independent of the LOW to HIGH transition of the clock signal. An asynchronous output enable is provided to ease asynchronous bus interfacing. Counter enable inputs are also provided to staff the operation of the address counters for fast interleaved memory applications. CE0 = VIH or CE1 = VIL for one clock cycle will power down the internal circuitry to reduce static power consumption. Multiple chip enables allow easier banking of multiple IDT70V9179's for depth expansion configurations. When the Pipelined output mode is enabled, two cycles are required with CE0 = VIL and CE1 = VIH to re-activate the outputs.
Depth and Width Expansion
The IDT70V9179 features dual chip enables (refer to Truth Table I) in order to facilitate rapid and simple depth expansion with no requirements for external logic. Figure 4 illustrates how to control the varioius chip enables in order to expand two devices in depth. The IDT70V9179 can also be used in applications requiring expanded width, as indicated in Figure 4. Since the banks are allocated at the discretion of the user, the external controller can be set up to drive the input signals for the various devices as required to allow for 18-bit or wider applications.
A15
IDT70V9179
CE0 CE1 VDD
IDT70V9179
CE0 CE1
VDD
Control Inputs
Control Inputs
IDT70V9179
CE1 CE0
IDT70V9179
CE1 CE0 CNTRST CLK ADS CNTEN R/W OE
Control Inputs
Control Inputs
5645 drw 18
Figure 4. Depth and Width Expansion with IDT70V9179
6.42 14
IDT70V9179L High-Speed 3.3V 32K x 9 Dual-Port Synchronous Pipelined Static RAM
Preliminary Industrial and Commercial Temperature Ranges
Ordering Information
IDT XXXXX Device Type A Power 99 Speed A Package A Process/ Temperature Range Commercial (0C to +70C) Industrial (-40C to +85C)
Blank I(1)
PF
100-pin TQFP (PN100-1)
7 9 12 L
Commercial Only Commercial & Industrial Commercial Only Low Power
Speed in nanoseconds
70V9179 288K (32K x 9-Bit) 3.3V Synchronous Dual-Port RAM
5645 drw 19
NOTE: 1. Contact your local sales office for Industrial temp range for other speeds, packages and powers.
Preliminary Datasheet: Definition
"PRELIMINARY" datasheets contain descriptions for products that are in early release.
Datasheet Document History
01/02/02: Initial Data Sheet
CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054
for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com
6.42 15
for Tech Support: 831-754-4613 DualPortHelp@idt.com
The IDT logo is a registered trademark of Integrated Device Technology, Inc.

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